This machine is especially designed for polish the big diameter carbide wire drawing dies reduction angle and back relief angle , typically dry drawing dies . This new generation lapper have more efficient and accurate capability with ten lapping head working together , meanwhile it is easy to operation and low cost of maintance .It could be achieve the full automatic production process.
Equipment parameters
Wire dies hole diameters : 0.20MM to 5.50MM Wire dies case dimension : standard as Ø38mm or Ø42mm , Height 25mm~28mm Lapping angle capability : according to your request , typically from 7°to 45° Working Pin Size : ø5*200mm ø8*220mm Equipment dimension :1600*920*1070( Working table :1600*1000*850)
Characters
Higher efficient with tens dies lapping one time ,could be add diamond paste automatically. Automatic feeding and PLC control Easy for operation and lower maintance cost Stable quality performance
Audited Supplier 
){kind=link}